Newly Designed Driver "f-Core for Wireless" to Realize Ultra-Low Distortion
Truly wireless earbuds often rely heavily on software equalization to adjust the sound characteristic, which generates issues that can be a side-effect and lead to a tiring listening experience. With the ZE2000, instead of fully depending on the equalizer, we've improved the fundamental performance of the driver units and optimized the acoustic space inside the earbuds to perfect the sound quality so that it is satisfying enough to listen to and equalizer is only utilized to make precise pinpoint effective corrections in narrow bands. However, in order to make the best use of this equalizer pinpoint correction, a driver unit with extremely high precision sound pressure frequency characteristics is required. If there is a variation of about 3dB level, which is the typical accuracy, the equalizer correction will lead to unnatural results. In order to solve this problem, we have developed a new "f-Core for Wireless " driver, which has been manufactured from scratch to achieve ultra-low distortion. Typically, the diaphragm of an earphone is made through monolithic injection molding where plastic material is injected into a mold with the center and surround are formed at the same time.However, in the case of small-diameter driver units, tangential corrugations are normally added on the surround to stabilize the movement of higher amplitude resulting in a rotational movement of the diaphragm that causes distortion. In the case of "f-Core for Wireless", the center is made of a special resin that is both light and hard. The surround of the diaphragm is made of a special, extremely flexible silicone, which ensures smooth and undistorted diaphragm movement. With the combination of these 2 special materials, despite its 6mm diameter, the area of effect of its center is equivalent to that of a 9mm diameter monolithic injection molded diaphragm. This also contributes to the reduction of distortion. In addition, the special silicone surround and center are directly molded together without the use of adhesives, which improves assembly accuracy and significantly reduces weight, thus contributing to a reduction in distortion.